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Data Sheet
XFP Optical Transceivers for 40km 10G Datacom & Storage Applications IGF Series IGF-17511J
Features: The Bookham IGF Series optical transceiver modules are highperformance, cost-effective modules for serial optical data communication applications at 10Gb/s. The IGF-17511J is designed to provide 10Gb/s Ethernet for 40km compliant links. The modules are designed for single mode fibre and operate at a nominal wavelength of 1550nm. The modules aid system hardware engineers in implementing low-cost single mode PMD solutions, which are protocol transparent. The "hot pluggable" feature built into every module reduces manufacturing cost, inventory costs and allows optical port upgrades at the customer premises. Built-in remote monitoring via digital diagnostics allows user access to static and dynamic data as well as module condition. The IGF-17511J uses an Externally Modulated Laser (EML) packaged in conjunction with an optical isolator for excellent back reflection performance. The Bookham IGF series of modules have been extensively tested utilizing industry standard single mode fibers in order to ensure compatibility with enterprise, access and metro systems. * Compliant IEEE802.3 10G Ethernet (10GBASE-ER/EW) 10GFC INCITS Project 1413-D * Compliant with the XFP MSA * Ultra small form factor * 10Gb/s serial operation * Hot Pluggable * Supports 40km link distances * Integrated PIN receiver technology * Data rates from 9.9Gb/s to 10.52Gb/s * XFI electrical interface * On board Enhanced Digital Diagnostics providing I2C remote monitoring capability * Typically less than 3.0 W power dissipation * Integral Signal Conditioning ICs enabling FR4 host board PCB traces up to 8 inches * Duplex LC connector * Low EMI * Transmit disable and loss-of-signal functions * RoHS compliant
Applications: * 10Gb/s Gigabit Ethernet 10GBASE-ER/EW, 10G Fibre Channel * Client side interconnection * Inter-office connections
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Data Sheet
Absolute maximum ratings
Parameter Storage Temp Supply voltage 5 Supply voltage 3 Supply voltage 2 Supply voltage E5 Data AC volt. differential Data DC volt. Optical Damage Threshold Symbol Tstg VCC5 VCC3 VCC2 VEE5 Tx+, TxTx+, TxPDamage Min -40 0 0 0 0 -0.5 0 Max 85 6 4.0 2.2 -6 2 VCC2 +5 Units C V V V V Vpp Vpp dBm
[1]
Notes
[1] VEE5 supply is not used - if voltage is applied to these pins it must be within the limits specified
Recommended operating conditions
Parameter Baud rate Supply voltage 5 Supply current 5 Supply voltage 3 Supply current 3 Supply voltage 2 Supply current2 Supply voltage
E5
Symbol
Min 9.95
Typ
Max 10.5
Units GBd V mA V mA V mA V
Notes STM-64/OC192; G.709; 10 GbE;
VCC5 ICC5 VCC3 ICC3 VCC2 ICC2 VEE5 Pw Tcase
4.75
5.0 350
5.25 550 3.47 200 1.89 750
[1]
3.13
3.3 90
[1]
1.71
1.8 50 -5.2 2.3
Supplies TEC, current draw depends on temp [1]
[2] [3]
Power dissipation Temperature case
Please contact sales for special requirements
3.5 70
W C
-5
[1] Typical figures for supply current and power dissipation represent start-of-life 40C. Max figures for supply currents and power dissipation are worst case, end-of-life, over temperature. Currents are quiescent values and exclude inrush. [2] VEE5 supply is not used - if voltage is applied to these pins it must be within the limits specified. [3] Maximum currents from each supply rail not all present simultaneously.
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Data Sheet
Operating Specifications - electrical
Tcase = -5oC to +70oC
Parameter CML input (differential) CML output (differential) Rise/Fall time Loss of signal Output voltage high Output voltage low Loss of signal timing Input voltage high Input voltage low Tx_Disable High Tx_Disable Low TA TD VDH VDL 2 0 100 100 VCC3+0.3 0.8 s s V V VOH VOL 2 0 VCC3+0.3 0.8 V V Symbol Min VTxDiff VRxDiff Tr/Tf 150 360 24 Value Typical Units Max 900 770 mVpp mVpp ps 100 ohm differential 100 ohm differential 20% - 80% Notes
Transmitter operating specifications - optical
Tcase = -5oC to +70oC
Parameter Center wavelength Optical transmit power Side mode suppression Extinction ratio Optical path penalty Output optical eye Symbol Min c Po SMSR ER OPP 1530 -1.0 30 8.2 2 Value Typical 1550 Units Max 1565 +2.0 nm dBm dB dB dB 800 ps/nm disp. EOL Notes
Compliant with IEEE 802.3ae and 10GFC INCITS Project 1413-Deye mask
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Data Sheet
Receiver operating specifications - optical
Tcase = -5oC to +70oC
Parameter Input operating wavelength Receiver sensitivity Stressed receiver sensitivity in OMA Maximum input power (overload) Reflectance Loss of Signal Loss of Signal Assert (Off to On) Loss of Signal Deassert (On to Off) Hysteresis PA PD PA - PD 0.5 -32 -19 -17 6 dBm dBm dB Symbol Min PIN-MIN SRS PIN-MAX +2 -27 1290 -19.0 -13.5 Value Typical Units Max 1565 -15.8 -11.4 nm dBm dBm dBm dB Ave. power at ER=8.2dB[1]
[1]
Notes
Ave. power
[1] BER 1E-12 used for Rx sensitivity measurements.
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Data Sheet
Electrical pin out
Bottom of Board as viewed through top of board Top of Board
GND 1 GND TD+ 2 3 4 5 6 7 8 9 VEE5 TDMod_Desel GND Interrupt GND TX_DIS RefCLKVCC5 RefCLK+ GND GND VCC3 VCC2 VCC3
P_down/RST
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
1 GND 2 VEE5 3 Mod_Desel 4 Interrupt 5 TX_DIS 6 VCC5 7 GND 8 VCC3 9 VCC3 10 SCL 11 SDA 12 Mod_Abs 13 Mod_NR 14 Rx_LOS 15 GND
GND TD+ TDGND GND RefCLKRefCLK+ GND VCC2
P_down/RST
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
10 SCL VCC2 11 SDA GND 12 Mod_Abs RD+ 13 Mod_NR RD14 Rx_LOS GND 15 GND
VCC2 GND RD+ RDGND
Towards Bezel
Towards ASIC
Figure 1: XFP Module Board Pinout & Names
Figure 2: Host Board Connector Pinout Top View
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Data Sheet
Pin definitions
Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 LVTTL-I CML-O CML-O LVTTL-I LVTTL-I/O LVTTL-O LVTTL-O LVTTL-O LVTTL-I LVTTL-O LVTTL-I Logic Symbol GND VEE5 Mod_Desel Interrupt TX_DIS VCC5 GND VCC3 VCC3 SCA SDA Mod_Abs Mod_NR RX_LOS GND GND RDRD+ GND VCC2 P_down/RST Function Module Ground; Signal Ground Optional -5.2V Power Supply Module De-select; When held low by host allows the module to respond to 2-wire serial interface commands Interrupt_BAR; Indicates the presence of an important condition that can be read over the two wire interface Transmitter Disable; Turns Off Transmitter Laser Source +5V Power Supply Module Ground; Signal Ground +3.3V Power Supply +3.3V Power Supply Two Wire Interface Clock Two Wire Interface Data Line Indicates Module Not Present; Grounded in Module Module Not Ready or Indicating Module Operational Fault Receiver Loss of Signal Indicator Module Ground; Signal Ground Module Ground; Signal Ground Receiver Inverted Data Output Receiver Non-Inverted Data Output Module Ground; Signal Ground +1.8V Power Supply Power down; When high, places the module in the low power standby mode of less than 1.5W with 2-wire interface still operational. Reset; The falling edge of P_Down/RST initiates a complete module reset including the 2-wire interface. +1.8V Power Supply Module Ground; Signal Ground Reference Clock Non-Inverted Input, AC coupled on Host Board Reference Clock Inverted Input, AC coupled on Host Board Module Ground; Signal Ground Module Ground; Signal Ground Transmitter Inverted Data Input Transmitter Non-Inverted Data Input Module Ground; Signal Ground Plug Seq 1 2 3 3 3 2 1 2 2 3 3 3 3 3 1 1 3 3 1 2 1 2 2 2 2 2 1 1 1 2 Notes 1
3 2 1 3 3 1 1 3 3 1 1 1 3 3 1 1
22 23 24 25 26 27 28 29 30 CML-I CML-I PECL-I PECL-I
VCC2 GND RefCLK+ RefCLKGND GND TDTD+ GND
6
[1] Module ground pins are isolated from the module case and chassis ground within the module. [2] Open Collector should be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.6V on the host board. [3] Reference clock is required for IGF-17511J.
Data Sheet
Figure 3. Host Board Supply Filtering
Figure 4. Host Board mechanical layout (mm)
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Data Sheet
Mechanical interface
The XFP module is a pluggable module with its foundation based on the successful SFP package configuration It consists of a rectangular package that is approximately 18mm wide and 78mm long. The module interface is a 30 lead connector. The module is inserted into a metal cage assembly.
Figure 5. Example of clip-on heat sink
Thermal interface
One of the unique features of the XFP module is that the module cage is designed with the ability to accommodate a clip-on thermal heat sink, as shown in Figure 5, to enhance the cooling of the module. Thus the equipment manufacturer that designs with the XFP can select a heat sink that is optimized for the particular environmental conditions of vertical space above module, air flow, air-flow direction and desired pressure drop.
Figure 6. Mechanical Dimensions (mm) of the XFP module.
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Data Sheet
Figure 7. Interface Design with Bezel (mm)
Management Interface
Digital diagnostics is available on all Bookham XFP transceivers. A 2-wire Serial ID interface provides user access to vendor/module identification, customer specific data, link type, static and dynamic monitor hooks, and a check code mechanism for verifying accuracy in the data registers. These "static" and "dynamic" diagnostics allow users to remotely and accurately identify modules and their vendors, make determinations about its compatibility with the system, verify which "Enhanced" diagnostics are supported, and monitor module parameters to determine the module and link condition. The module's "Enhanced Digital Diagnostics" features provide real-time monitoring of receiver input power, transmitter power, internal module temperature, laser bias current, and supply voltage parameters. The 2-wire serial ID interface was originally defined by the GBIC (GigaBit Interface Converter) and SFF-8472 specifications. The XFP MSA (Multi-Source Agreement) document further defined the diagnostics features and introduced a new memory map of the diagnostic information. This interface is a 2-wire interface that allows read-only access to separate memory locations. The memory location starting at A0h (data address 0 ~ 127) contains the Digital Diagnostic Functions. The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for the diagnostics and control functions that must be accessed repeatedly. One exception to this is that the standard module identifier Byte defined in the GBIC and SFP is located in Byte 0 of the memory map (in the diagnostics space) to allow software developed for multiple module types to have a common branching decision point. This Byte is repeated in the Serial ID section so that it also appears in the expected relationship to other serial ID bits. Multiple blocks of memories are available in the upper 128 Bytes of the address space. These are individually addressed through a table select Byte which the user enters into a location in the lower address space. Thus, there is a total available address space of 128 * 256 = 32Kbytes in this upper memory space. The upper address space tables are used for less frequently accessed functions such as serial ID, user writable EEPROM, reserved EEPROM and diagnostics and control spaces for future standards definition, as well as ample space for vendor specific functions. These are allocated as follows: * Table 01h: Serial ID EEPROM * Table 02h: User writable EEPROM The details of each memory space are found in the XFP MSA specification Chapter 5. Reference Documents: 1. XFP MSA revision 4.0, INF-8077i, "10 Gigabit Small Form Factor Pluggable Module" found at www.xfpmsa.org; April 13, 2004.
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Data Sheet
Regulatory compliance
Bookham IGF-3000 Series 1550 nm XFP transceivers are designed to be Class 1 Laser compliant. They are certified per the following standards: Feature Agency FDA/CDRH Laser Safety TUV Standard CDHR 21(J) CFR 1040.10 IEC/EN 60950-1:2001 IEC/EN 60825-1/A2:2001 CAN/CSA-60825-1-03 Component Safety UL/CSA CAN/CSA-C22.2 No. 60950-1-03 UL 60950-1:2003 UL 94 V-0 MIL-STD-883 Method 3015 IEC61000-4-2 Part 15 Class B FCC/89/336/EE EMI [EU Directive] EN55022, EN55024 Class B 73/23/EEC (Low voltage) 89/336/EEC (EMC) FCC Class B margin = 46.0 dBuV/m EN55022 Class B margin = 15.9 dBuV/m Pass Certificate/Comments 0520196-02 US-TUVR-3130 CU72060154 U8V 06 06 54880 002
ESD
IEC
Pass
CE
EU Directives
This product meets the requirements of the relevant EMC standards (EN 55022, EN 55024, FCC Part 15). However the EMC performance of the product within the host system may depend on characteristics of the host system over which Bookham has no control. It may therefore be necessary to ensure that the host system provides adequate grounding & shielding of the product.
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Data Sheet
RoHS Compliance
Bookham is fully committed to environment protection and sustainable development and has set in place a comprehensive program for removing polluting and hazardous substances from all of its products. The relevant evidence of RoHS compliance is held as part of our controlled documentation for each of our compliant products. RoHS compliance parts are available to order, please refer to the ordering information section for further details.
Ordering Information: IGF-17511J TRx 10G 40KM XFP GE COM
Contact Information
North America Bookham Worldwide Headquarters
2584 Junction Ave. San Jose CA 95134 USA * Tel: +1 408 919 1500 * Fax: +1 408 919 6083
Europe Paignton Office
Brixham Road Paignton Devon TQ4 7BE United Kingdom * Tel: +44 (0) 1803 66 2000 * Fax: +44 (0) 1803 66 2801
Asia Shenzhen Office
2 Phoenix Road Futian Free Trade Zone Shenzhen 518038 China * Tel: +86 755 33305888 * Fax: +86 755 33305805 +86 755 33305807
Important Notice Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by Bookham before they become applicable to any particular order or contract. In accordance with the Bookham policy of continuous improvement specifications may change without notice. The publication of information in this data sheet does not imply freedom from patent or other protective rights of Bookham or others. Further details are available from any Bookham sales representative.
www.bookham.com sales@bookham.com
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BH13399 Rev 1.0 February 2007 (c)Bookham 2005. Bookham is a registered trademark of Bookham Inc.

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